OPTOELECTRONIC COMPONENT FOR SURFACE MOUNTING, AND METHOD OF MANUFACTURING IT

摘要

The invention relates to an optoelectronic component for surface mounting of the type having an opto-electronic element arranged on the bottom of a cavity provided in a support and to the method of manufacturing same. The component includes a cavity coated with a metallization coating. The optoelectronic element is soldered on the bottom of the cavity. The support is a substrate of Si strongly doped with the first conductivity type, whose surfaces are orientated according to the plane (100), while the metallized surfaces of the cavity are formed by the preferential attack according to the planes (111). Regions of the second conductivity type are diffused into the cavity and into a cavity merging into the latter from the lower surface of the substrate. The element is soldered with suitable polarity, and insulation is provided by a diode connected with reverse polarity in parallel with its terminals. The contact points at the lower surface of the substrate permit surface mounting. The components are obtained by cutting the substrate in two directions.