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发明名称
DIE BONDING EQUIPMENT
摘要
申请公布号
JPH02106045(A)
申请公布日期
1990.04.18
申请号
JP19880260126
申请日期
1988.10.14
申请人
MATSUSHITA ELECTRON CORP
发明人
YAMAGUCHI YUKIO;ITO YASUO
分类号
H01L21/52
主分类号
H01L21/52
代理机构
代理人
主权项
地址
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