发明名称 INSPECTION METHOD FOR JUNCTION WAFER
摘要 PURPOSE:To enable the detection of a practically not-yet joined part in a nondestructive manner by a method wherein a junction wafer as a sample is arranged in a Lang camera, and Lang topograph is obtained by using X-ray, or further the obtained image is processed, thereby detecting the not-yet joined part of a junction interface of the junction wafer. CONSTITUTION:A junction wafer 10 as a sample is arranged in Lang camera 22; the divergence angle of an X-ray flux radiated from an X-ray source 38 is limited by a first slit 26; a second slit 28 wider than the first slit 26 is arranged on the rear side of a junction wafer 10, in order that only the diffraction X-ray of, e.g., Ka may be transmitted; the diffraction X-ray is made to reach, e.g., a photographic plate 36 through the second slit 28. While the above diffraction condition is kept, a scanning stand 34 mounting the junction wafer 10 and the photographic plate 36 is subjected to reciprocating movement pallarel to the surface of the junction wafer 10, and Lang topograph in a wide range of the junction wafer 10 is obtained, or further the image is processed, thereby detecting a not-yet joined part of a junction interface of the junction wafer 10. By this set-up, it can be easily checked in a nondestructive manner whether a junction state is practically maintained.
申请公布号 JPH02106052(A) 申请公布日期 1990.04.18
申请号 JP19880260326 申请日期 1988.10.14
申请人 SHIN ETSU HANDOTAI CO LTD 发明人 NAKANO MASAMI;ABE TAKAO
分类号 H01L21/02;G01N21/87;G01N23/18;G01N23/207;H01L21/18;H01L21/20;H01L21/66 主分类号 H01L21/02
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