| 摘要 |
PURPOSE:To restrain occurrence of dust, to remove a resist as it is desired, to reduce pattern defects, and to enhance yield by changing the rotation speed of a substrate in 2 stages. CONSTITUTION:The step A is a resist coating process, the step B is a high-speed idling rotation process for uniformizing a resist 3 film on the surface of the substrate 1, the step C is a first edge rinsing process, the step D is a second edge rinsing process in a rotation speed made higher than that of the first step, and the step E is a high-speed idling rotation process for removing the excess resist to improve the sharpness of the resist 3, thus permitting merits in each of high-speed and low-speed conditions to be utilized in the case of removing the resist on the periphery of the substrate 1, to reduce the thickness on the periphery, to improve the sharpness of the resist 3, and so the resist to be processed on the periphery to a desired state, and a normal pattern to be formed. |
