发明名称 SEMICONDUCTOR DEVICE
摘要 PURPOSE:To prevent a signal power-supply wiring part from being disconnected when corrosion progresses by a method wherein an uppermost-Iayer wiring layer of a multilayer structure is not connected directly to a bonding pad on the same layer but is connected to a bonding pad at a lower-layer wiring layer. CONSTITUTION:A second-layer wiring part is connected to a bonding pad 109 formed in a first-layer wiring layer. A second-layer signal power-supply wiring part connected to a bonding pad in a first layer via a through hole made in an interlayer insulating film 104 near the bonding pad 109; even when aluminum in this part is corroded, the wiring layer is not disconnected.
申请公布号 JPH02105419(A) 申请公布日期 1990.04.18
申请号 JP19880258715 申请日期 1988.10.13
申请人 NEC CORP 发明人 KUSUSE NORIO
分类号 H01L23/52;H01L21/3205;H01L21/60 主分类号 H01L23/52
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