| 摘要 |
PURPOSE:To enable a base to be easily bonded requiring no machining process at all by a method wherein an O ring with larger outer diameter and smaller inner diameter than the inner diameter of a mold is mounted on a stepped part of a resin bung hole of the mold in the case of performing the resin molding process. CONSTITUTION:The inner diameter d1 of a resin bung hole of a mold 8 is made larger than the inner diameter d2 of the mold 8 to form a stepped part whereon an O ring 7 is mounted. The inner diameter d3 of the O ring 7 is smaller than the inner diameter d2 of the mold 8. Next, when the mold 8 is filled up with resin 9 and a lead frame 6 connecting to a LED chip 10 is inserted into the resin 9 before the resin 9 is hardened to be released after the resin 9 is hardened, a LED lamp 1 with the O ring 7 bonded onto the base thereof can be taken out. When the O ring 7 is taken out, the diameter of the base 1-1 of LED lamp 1 becomes smaller than that of the main body of LED lamp 1 thus a base 2 can be bonded onto this part using a bonding agent 3 to connect leads 6-1, 6-2. Through these procedures, the base 2 can be easily bonded requiring no machining process at all. |
