| 摘要 |
PURPOSE:To provide a highly moisture resistant molded semiconductor device by providing a wiring protective film such that it reaches part of a connection portion between a bonding wire and a bonding pad. CONSTITUTION:An oxide film 2 is provided on a semiconductor substrate 1, and an Al wiring for electrically connecting semiconductor device internal elements to the outside and a bonding pad 3 are provided, and further the Al wiring is coated with a moisture resistant protective film, e.g., a nitride film 4. A window is formed, taking into consideration that the nitride film 4 on the bonding pad partly reaches a bonding surface between the bonding wire and the bonding pad. Once the bonding wire 5 is bonded, part of the nitride film 5 enters between the bonding pad 3 and the bonding wire 5. Hereby, moisture is prevented from entering the portion covered with the nitride film 4 and the bonding portion between the bonding wire and the bonding pad, preventing the corrosion of Al and hence improving moisture resistance. |
