| 摘要 |
<p>PURPOSE:To make it possible to reduce the high-frequency loss of a circuit by a method wherein two lands are formed positionally deviated from a center line that links opposed electrodes on both sides of a chip component. CONSTITUTION:Two lands 2 are formed on a printed board 1 and electrodes 4 are respectively provided on both sides of a chip component 3 in opposition to each other. Moreover, with the component 3 arranged over between the lands 2 formed on the board 1, the component 3 is fixed on the board 1 and moverover, are soldered to the lands 2, where the opposed electrodes 4 on both sides of the component 3 correspond to each other. Furthermore, the two lands 2 on the board 1 are formed being caused a positional deviation from a center line (l) that links the opposed electrodes 4 on both sides of the component 3. Accordingly, a stray capacity, which is generated between the lands 2, is reduced. Thereby, the high-frequency loss of a circuit can be reduced.</p> |
