| 摘要 |
<p>PURPOSE:To reduce thermal expansion difference due to a transient temperature difference between inner side resin and outer side resin under conditions of rapid heating and rapid cooling during solder packaging by opposing a light emitting surface of a light emitting device to a photosensitive surface optically, then by sealing them in one body with translucent resin and by sealing a periphery thereof with untranslucent resin whose expansion rate is lower than that of translucent resin. CONSTITUTION:A photosensitive element 1, lead frames 2, 5, a light emitting element 4, translucent silicon resin 6, and untranslucent epoxy resin 7 are formed by the same material and the same constitution as conventional ones. And, translucent epoxy resin, whose leading of a filler consisting of crystal silica or dissolved silica is reduced and whose thermal expansion rate is increased when compared to the untranslucent epoxy resin 7, is used instead of a conventional translucent epoxy resin 3.</p> |
