| 摘要 |
PURPOSE:To eliminate contamination and stress on a chip and to omit wire bonding by connecting a formed lead frame to a light emitting window material through bumps on a chip, wrapping these parts with a resin material, and maintaining a hollow part between the chip and the window material. CONSTITUTION:A lead frame 3 which is formed by evaporation and the like is connected to glass 4 which is a light transmitting window material through bumps on a chip 1. The peripheral part of the frame 3 is wrapped with a high- melting-point resin 5. The entire chip 1 is wrapped with a resin material 6. Then, a hollow part is maintained between the rear surface of the glass 4 and the chip 1 in an airtight state. In this hollow constitution, there is no stress and contamination on the chip, and wire bonding can be omitted.
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