PARTIAL PLATING EQUIPMENT,申请号JP19880256354-传众专利搜索

首页产品黄页商标征信

会员服务注册登录

法人/股东/高管

发明名称	PARTIAL PLATING EQUIPMENT
摘要
申请公布号	JPH02104691(A)	申请公布日期	1990.04.17
申请号	JP19880256354	申请日期	1988.10.12
申请人	MATSUSHITA ELECTRIC IND CO LTD	发明人	YASHIKI TAKANOBU;KAWABE TAKAHIRO
分类号	C25D5/02	主分类号	C25D5/02
代理机构		代理人
主权项
地址

您可能感兴趣的专利

10-substituted 1-, 4, 7,-tris (carboxymethyl)-1,4,7,10-tetraazacyclo-dodecane derivative for use as contrast agents

2-AMINOBICYCLO 3.1.0 HEXANE-2,6-DICARBOXYLIC ESTER DERIVATIVE

1-PHENYL-2-OXO-3-SULFONYLAMINO-PYRROLIDINE DERIVATIVES AND RELATED COMPOUNDS AS FACTOR XA INHIBITORS FOR THE TREATMENT OF ACUTE VASCULAR DISEASES

FURAZANOBENZIMIDAZOLES

METHOD FOR MAKING CAPROLACTAM

ELECTROPHORETIC DIPPING SYSTEM

Method and system for multiple description coding and computer program product therefor

一种新型表面贴装石英晶体谐振器及制造方法

一种非等高障壁的制作方法

METHOD AND APPARATUS FOR FIXING A GRAFT IN A BONE TUNNEL

METHOD FOR THERMALLY PRINTING A DYE IMAGE ONTO A THREE DIMENSIONAL OBJECT USING FLEXIBLE HEATING ELEMENTS

Method and identification tag for asset management

Method of viewing audiovisual documents on a receiver, and receiver therefore

Systems and methods for electrosurgical tissue treatment in the presence of electrically conductive fluid

BONE ANCHORING ELEMENT

DEVICES FOR APPLYING ENERGY TO TISSUE

BANDAGE FOR WOUND OR INCISION CLOSURE

Device and procedure for assisting the fastening of a window element on a frameless door of a motor vehicle