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发明名称
Method for preparing thin copper foil-clad substrate for circuit boards
摘要
申请公布号
US4917758(A)
申请公布日期
1990.04.17
申请号
US19890354954
申请日期
1989.05.19
申请人
MITSUBISHI GAS CHEMICAL COMPANY, INC.
发明人
ISHIZUKA, KOICHI;GAKU, MORIO;ISHII, KENZI;KINBARA, HIDENORI;MOTEGI, MASAKAZU
分类号
C23F1/18;H05K3/06
主分类号
C23F1/18
代理机构
代理人
主权项
地址
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