| 摘要 |
A composition for reducing styrene monomer emissions in DCPD resins, while maintaining good interlaminate adhesion, comprising, (a) 0.001 to 1.0% by weight of a paraffin, (b) 0.001 to 3.0% by weight of an intermediate bonding promoter comprising the reaction product of (i) a saturated or unsaturated fatty acid containing 5 to 30, and preferably 10 to 20 carbon atoms, (ii) a mono- or diepoxy compound, (c) 0.0 to 10% by weight of alpha-methyl styrene, and (d) 0.0 to 1.0% by weight of a copper salt, wherein said composition results in styrene emission rates of 60 grams/square meter or less measured one hour after gelation, and retains at least 80% to 90% of the interlaminate adhesion properties of an unmodified resin.
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