| 摘要 |
A thermoelectric cooling design of the type having a nonconducting substrate mounting thermoelectric coolers is improved. Provisions for a flexible can and improved heat dissipation from the thermoelectric coolers are provided. For improved thermal response, the refrigerated vacuum can is provided with thin walls of high purity aluminum with the result that deformation of the wall surface, especially the bottom wall surface can occur both with respect to installation. A plurality of can heat sinks are placed on the walls of the can to form a unitary and locally rigid side wall to the can at the point of attachment. At least one thermoelectric cooler is communicated to the can heat sinks at a first side for receiving heat energy from the can. A second discharge heat sink is communicated to each thermoelectric cooler for dissipating heat energy from both the can and the thermoelectric cooler. Spring biased connections move the respective heat sinks towards one another and clamp the thermoelectric cooler firmly therebetween. The heat sinks dynamically conform to dimensional changes at the cooler interface during installation. The discharge heat sinks are integrally cast with copper plugs placed in an aluminum mold and the aluminum cast about the copper plugs. The copper plug is preferably gold plated to prevent oxidation and form a heat conducting alloy with the aluminum. This enables heat transfer with a low temperature gradient to produce cooling with high efficiency.
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