| 摘要 |
PURPOSE:To prevent the contact between the corner part of a semiconductor element and a wire bonding loop even if the loop of the wire is low by providing a slant surface which is different from functional regions for the pad part of the semiconductor element. CONSTITUTION:A bonding pad surface 4 is not the same surface of the functional regions of the surface and the end surface of a semiconductor element 1. Inclination is provided for the surface 4. The semiconductor element 1 is attached to a die pad part 7. The pad part 4 and an outer terminal pad part 5 of an outer lead 3 are connected with a piece of bonding wire 2. Thereafter, the device is sealed with a molding sealing resin 8 and assembled. In this way, the contact between the corner part of the semiconductor element and the wire bonding loop can be prevented. |
