PREPARATION OF INTEGRATED CIRCUIT DEVICE

摘要

PURPOSE:To inexpensively form an integrated circuit device with high dimensional accuracy and high efficiency by covering the input/output electrode of the integrated circuit element mounted and fixed to a part of a thin metal plate, whose one surface partially becomes an external connection terminal, on the other surface side thereof and the electrical connection part with the other surface of the thin metal plate of said circuit element with a seal resin. CONSTITUTION:An integrated circuit element 13 is mounted on the other surface 11b of a thin metal plate 11 at a predetermined position through an adhesive material 12 composed of an insulating resin and the adhesive material 12 is cured under heating to bond and fix said circuit element 13. The input/output electrode of the element 13 and the other surface 11b of the thin plate 11 are electrically connected using a metal wire 14. Next, the necessary electrical connection of the input/output electrode of the integrated circuit element 13 with the thin plate 11 is performed and, thereafter, the element 13, a metal wire 14 and the other surface 11b of the thin plate 11 are sealed and protected using a seal resin 15. Next, the thin plate 11 is cut on the side of the external connection terminal 11c thereof by a laser processing machine to remove said terminal 11c and separated to form a part of one surface of the thin plate 11 into a plurality of independent external connection terminals 11a. Next, the unnecessary part 11e of the thin plate 11 is cut and removed.