| 摘要 |
<p>PURPOSE:To shortly cut leads by a method wherein part of a tape main body is extended to the inside of a device hole and lead supporting/fixing parts for supporting the points of the leads are provided on the side more inner than bump electrodes on an integrated circuit chip. CONSTITUTION:An integrated circuit chip 1, a multitude of pieces of bump electrodes 2 and a tape main body 3 consisting of an insulating film and the like are provided, part of the main body 3 is extended to the inside of a device hole 4 subjected to punch work in the tape main body 3 to constitute lead supporting/fixing parts 8 in the hole 4 and these parts 8 are made to position on the side more inner than the electrodes 2. Moreover, a copper foil is closely adhered on the main body 3, this main body 3 adhered closely the copper foil is etched in a necessary pattern and moreover, is subjected to plating treatment to form lead frames 5, wiring patterns 6 and electrodes 7 for test use, the lead frames 5 are made to face the hole 4 and a multitude of leads 5a are made to correspond to the electrodes 2. As this result, after both of the leads 5a and the electrodes 2 are made to thermally fix by pressure and are connected to each other, each lead 5a and the parts 8 can be cut in the hole 4. Thereby, the leads can be shortly cut and the package can be miniaturized.</p> |
