| 摘要 |
PURPOSE:To enable the positions on a wafer surface to be detected with high precision by a method wherein the functions representing the wafer surface shape are calculated conforming to a plurality of surface position data. CONSTITUTION:The surface positions in almost the same points in multiple exposed regions arranged on a wafer are respectively detected to collect a plurality of surface position data so that the functions representing the wafer surface shape may be calculated conforming to the surface position data. Then, the surface position data in the points in exposed regions are corrected conforming to the constant terms of the surface shape functions. For example, a reference point for detecting surface position out of measurement points is previously decided to be e.g., a measurement point 71 in this case so that the offset value C1 of this point may be previously calculated by an experiment. Consequently, the other offset values i.e., the constant terms C2-C5 can be calculated as the differences from the value of C1. Through these procedures, the offset values C1-C5 can be calculated to enhance the reliability of the offset values. |
