| 摘要 |
PURPOSE:To enable photoconductive particles to cover the surfaces of resin particles uniformly and strongly with the photoconductive particles by passing both particles through a specified impact-subjecting section under specified conditions. CONSTITUTION:The resin particles A and the photoconductive particles B having a particle diameter of <=1/5 of that of the resin A are passed at an environmental temperature of 10-90 deg.C through the impact-subjecting section having the minimum gap of 0.5-5mm and comprising rotary pieces and fixed pieces, or comprising 2 kinds of rotary pieces, thus permitting the particles B to be fixed to the surfaces of the particles A, that is, the particles A to be partially melted or softened by the mechanical energy given by the impact in the section and the heat energy caused by partial conversion of the mechanical energy, and the fixing treatment to be executed. |
