| 摘要 |
PURPOSE:To prevent the peeling of a resin sealing a chip through thermal expansion, etc. by forming a linear projecting stripe or recessed stripe along the longitudinal direction to an inner lead section for a lead frame on which the semiconductor chip is loaded. CONSTITUTION:Projecting stripes or recesses stripes extending in parallel along the longitudinal direction are shaped to the upper surface or lower surface of a frame blank 5 for a lead frame, on which a semiconductor chip for a resin seal type semiconductor device is loaded, when molding the frame blank 5. A section on which the chip is loaded and wire-bonded sections are avoided as sections where the projecting stripes or the recessed stripes are formed. The projecting stri- pes or the recessed stripes take a shape that they excellently bond with a sealing resin. |
