| 摘要 |
PURPOSE:To improve a printing quality and obtain a compact head by a method wherein LED array chips each having a light emitting part and a bonding pad on the both sides thereof are disposed so that the light emitting parts are aligned in a straight line and the bonding pads are positioned in staggered manner reversely to each other, and LSI chips are arranged on the side of the bonding pads. CONSTITUTION:The title head is provided with a plurality of LED array chips 1 each having a light emitting part 3 and a bonding pad 2 on the both sides thereof, a plurality of LSI chips 4 for driving the LED array chips 1, and Au wires 5 for bonding the LED array chips with the LSI chips. The LED array chips 1 are disposed so that the light emitting parts 3 are aligned in a straight line and the bonding pads 2 are staggered reversely to each other. In this construction, a light leaking from the side face of the LED array chip 1 is reflected by the adjacent LED array chip 1, whereby a quantity of light to be exposed to a photosensitive body disposed upwards can be reduced. In addition, since a length A of the LSI chip 4 may be longer than a length C of the LED array chip 1, a width B of the LSI chip 4 can be also reduced. Therefore, a total width G can be reduced. |
