| 摘要 |
PURPOSE:To prevent the surface of a chip-shaped electronic component from being contaminated with an adhesive by a method wherein a means used to forcibly cool the electronic component is arranged in a position where a transfer tape is passed between a coating means and a component separation means. CONSTITUTION:A chip-shaped component 4 whose insulating paint has been dried and hardened in a drying furnace 1 is discharged from the drying furnace 1 and is then cooled to 10 deg.C or lower, -10 to 10 deg.C inside a forced cooker 10. This operation is used to cool an adhesive face of a transfer tape 3; when the face is cooled down to 10 deg.C or lower, an adhesive power of most adhesives is lowered. The transfer tape 3 which has been cooled by means of the forced cooler 10 is passed through a component separation means 13 in a state that the chip-shaped component 4 has been glued. Thereby, the chip-shaped component 4 can be separated easily; it is possible to prevent an adhesive from adhering to a peripheral face of the chip-shaped component 4. |
