| 摘要 |
PURPOSE:To vapor deposit required patterns on the surface of a substrate by moving the substrate at a suitable speed while vapor-depositing said patterns through the small hole of a mask fixed onto the substrate. CONSTITUTION:Patterns are vapor-deposited on a wafer 13 placed on a wafer susceptor 1 slightly spacially from a mask 2 fixed on a mask supporting plate 4 through the small hole 3 of the mask 2. The wafer 13 receives the vapor deposition while the wafer is moved at a suitable speed in approximately parallel with the mask 2 by means of the susceptor 1 which is connected to an X-Y table 5 consisting of moving tables 8, 11 to be moved in X-X' directions and Y- Y' directions by means of screws 7 and 10 under guiding of guides 6, 6' and 9, 9' and is moved by means of a connecting member 12. By this movement, endless patterns and sharp edge patterns are vapor-deposited on the wafer 13. |
