| 摘要 |
<p>A tape automated bonding method and structure is disclosed. Interconnection using prepatterned metal beam tape interconnect is accomplished by providing vias (10,20) in passivation layer (8) overlaying a metal region (6) in or on the major surface (4) of the device which is to receive the interconnect leads (18), eliminating the requirement for bonding pad bumps. Ultrasonic pressure is applied to the beams (18) as they superpose the vias, bonding each lead to its respective metal region (6).</p> |
