Plated-through hole plugs for eliminating solder seepage

摘要

A process is illustrated to provide plated through holes for connecting between opposite sides of a circuit board such as an insulating ceramic substrate while maintaining a smooth surface on the circuit side to facilitate the process of defining the circuit pattern. The plated-through hole process is designed to uniformly cap or plug all of the plated-through holes to prevent solder from the backside from flowing through the holes to the circuit side and damaging (short-circuitry adjacent paths) the finished product.