| 摘要 |
<p>PURPOSE:To efficiently and surely dehumidify a large number of printed wiring boards and surely correct the warpage of the respective board by a structure wherein the warpage correcting device concerned consists of a dehumidifying device to dehumidify a large number of the printed wiring boards standing on end, a heating device for correcting the warpage of the respective board and a pressing device to press the boards. CONSTITUTION:The warpage correcting device concerned of printed wiring board consists of a dehumidifying device B to dehumidify a large number of printed wiring boards A standing on end with clearance between the boards, a heating device C for correcting warpage by heating a large number of the printed wiring boards, which are dehumidified by the dehumidifying device B and a pressing device D to press the printed wiring board A heated with the heating device C so as to correct its warpage. A large number of printed wiring boards A are dehumidified so as to evenly dehumidify the boards A from both sides of each board in a short period of time by the dehumidifying device B and, after that, a large number of prided wiring boards A, which are dehumidified with the dehumidifying device B, are efficiently heated by the heating device C under the condition that the boards A are stood on end at intervals. Finally, the warpage of the board is corrected by being pressed with the pressing device D.</p> |
