发明名称 RESIN COMPOSITION
摘要 PURPOSE:To obtain the title composition improved in adhesion to a polyolefin adhesive layer and stability during melt molding by mixing an ethylene/vinyl acetate copolymer saponificate with a specified phosphate, a substituted phenol derivative and an organophosphite compound. CONSTITUTION:An ethylene/vinyl acetate copolymer saponificate (A) of an ethylene content of 20-60mol% and a degree of saponification of the vinyl acrtate component >=95mol% is mixed with a mixture (B) of an alkali metal secondary or tertiary phosphate (e.g., dipotassium phosphate) with, optionally, an alkali metal carboxylate, 0.001-5-wt.%, based on component A, substituted phenol (C) [e.g., 1,3,5-trimethyl-2,4,6-tris(3,5-di-t-butyl-4-hydroxybenzyl)-benzene] and 0.001-5wt.%, based on component A, organophosphite compound (D) [e.g., bis(2,6-di-t-butylphenyl)pentaerythritol diphosphite] to obtain a resin composition containing 15-250ppm alkali metal and 5-5000ppm phosphorus based on component A.
申请公布号 JPH0297543(A) 申请公布日期 1990.04.10
申请号 JP19880179482 申请日期 1988.07.19
申请人 NIPPON SYNTHETIC CHEM IND CO LTD:THE 发明人 MORIYAMA TAKAMASA;SHIBUYA MITSUO;IWANAMI TERUO
分类号 C08K13/02;B32B27/28;C08K3/32;C08K5/13;C08K5/49;C08L23/26;C08L29/04 主分类号 C08K13/02
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