PACKAGE FOR SEMICONDUCTOR,申请号JP19880251295-传众专利搜索

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发明名称	PACKAGE FOR SEMICONDUCTOR
摘要
申请公布号	JPH0298166(A)	申请公布日期	1990.04.10
申请号	JP19880251295	申请日期	1988.10.04
申请人	NEC CORP	发明人	NAKADA TAKAAKI
分类号	H01L23/50	主分类号	H01L23/50
代理机构		代理人
主权项
地址

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