| 摘要 |
PURPOSE:To make it possible to use easily workable and non-expansive material and to manufacture a resin formed body with circuit at low cost and in a short period of time by a method wherein a flexible printed circuit film is arranged onto a forming die surface and the forming die is covered by a thermally softened thermoplastic resin sheet so as to be pressed by pressurized air from a surface opposite to the die. CONSTITUTION:A flexible printed circuit film 11 is set onto the die surface of a die 12 and, further, a thermally softened thermoplastic resin sheet 13 is arranged on the die 12. The resultant die 12 is covered by the sheet 14 by pressing the periphery of the sheet 13 against the edge of the die 12. The edge of a chamber 15 is brought into close contact with the sheet 13 so as not to leak air through between the edge and the sheet. When pressurized air is charged in the chamber 15, the sheet 13 is formed after the die surface and bonded to the film 11. At this time, the air lying between the die 12 and the sheet 13 is exhausted outside through exhaust holes 17. After the die 12 is cooled down, the sheet 13 is removed from the chamber 15 and the die 12. Finally, by cutting off excess portion from the sheet, a resin formed body 18 with the circuit film 11 is obtained. |
