| 摘要 |
A microwave integrated circuit includes a silicon chip having a pair of diffused junctions. A pair of gold leads 0.3 mils thick are in contact with respective ones of the diffused junctions depending from the chip parallel to the top surface of an alumina substrate 15 mils thick with an adhesive layer of an alumina-filled epoxy at most 0.1 mils thick between the beam leads and the substrate.
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