| 摘要 |
PURPOSE:To reduce variations in a manufacturing process by interposing solid and plate-shaped thermosetting resin between a semiconductor chip and a member on which the semiconductor chip is mounted, and subjecting the resin to a specific processing. CONSTITUTION:Thermosetting resin 4 having an open portion by which a solder 3 is received is placed on a substrate 1, and a flip chip 5 having a solder bump 6 as an electrode is placed on the thermosetting resin 4. Heat treatment is performed at a temperature higher than a melting point of the solder, and thereafter the temperature is lowered to permit die sample to be heated at a temperature higher than a temperature where the thermosetting resin is hardened and lower than the melting point of the solder. Therefore, the solder located at a bonding portion is solidified into a columnar solder 7, and the thermosetting resin 4 is first softened into a liquid to fill among the chip, the substrate, and the surroundings of the columnar solder 7. Hereby, the thermosetting resin 4 can satisfactorily be filled to reduce the variation of resin thickness. |
