| 摘要 |
PURPOSE:To securely bring a probe into contact with an intended wiring without causing any short-circuiting between adjacent wirings and without causing any deterioration of those wirings by forming an insulating film on the wirings covering also hole portions of the wirings. CONSTITUTION:In a semiconductor device in which a probe is brought into contact with a wiring upon analyzing a semiconductor integrated circuit, a hole portion 5 is formed through part of a wiring 3 and an insulating film 4 is formed on a wiring 2 including the hole portion 5. Thereupon formed is a stepped portion also on the insulating film 4 owing to the hole portion 5 on the wiring surface. Accordingly, upon exerting pressure on the probe 6, the probe 6 is brought to contact with the stepped portion 7 of the insulating film 4 and is prevented from slipping. Hereby, a thinned portion of the insulating film 4 at the stepped portion 7 is easily broken, and allows the tip end of the probe 6 to securely make contact with a wiring section around the hole portion 5. Further, the wiring surface is covered with the insulating film 4 to prevent the wiring 3 from being deteriorated. |
