| 摘要 |
PURPOSE:To prevent an insulating film from being damaged during an ultrasonic thermocompression bonding operation by interposing a barrier metal between the insulating film and interconnections in a bonding pad section. CONSTITUTION:A barrier metal layer 8 is formed of a barrier metal such as titanium, tungsten, molybdenum or the like between an insulating film 2 and at least a bonding pad section of Al interconnections 4 over a silicon substrate 1. This barrier metal layer 8 buffers load or ultrasonic waves exerted during ultrasonic thermocompression bonding of a lead wire 6 and prevents the insulating film 2 from being damaged thereby. Thus, removal of the lead wire can be prevented effectively. |
