发明名称 MANUFACTURE OF MULTILAYER PRINT CIRCUIT BOARD
摘要 PURPOSE:To improve heat impact proof characteristic (cracking resistance) by insulating signal circuits mutually or insulating a signal circuit from a power supply circuit through an insulating layer and by constituting each insulating layer wherein resin of a large bending strength is immersed and cured. CONSTITUTION:Insulation is made between signal circuits 2 or between a signal circuit 2 and a power source circuit 1 by an insulating layer whose dielectric constant at one MHz is at most 4. Resin (which shows a value of the upper side of the line l1) whose bending strength after cured is larger than a value of a heat stress between a signal circuit conductor shown by a line l1 and the insulating layer, is immersed in the insulating layer of the signal circuit 2. In the insulating layer of the power source circuit 1, resin (which shows a value of the upper side of a line l2) whose bending strength after cured is larger than a value of a heat stress between the power source circuit conductor shown in the line l2 and the insulating layer is immersed. Cracks in each insulat ing layer can be thereby prevented.
申请公布号 JPH0294697(A) 申请公布日期 1990.04.05
申请号 JP19880246977 申请日期 1988.09.30
申请人 HITACHI LTD 发明人 KATAGIRI JUNICHI;NAGAI AKIRA;TAKAHASHI AKIO;SUGAWARA TOSHIO;ONO MASAHIRO;KOBI AKIO;WAJIMA MOTOYO;OKI NOBUAKI;FURUKAWA KIYONORI
分类号 H05K3/46;H05K1/03 主分类号 H05K3/46
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