| 摘要 |
<p>PURPOSE:To maintain the throughput of transfer of substrates high and to realize the attachment and detachment of the substrate of a wafer or the like with high reliability by detecting that a substrate holding hand approaches a position of a predetermined distance with respect to a substrate mounting base, further detecting that the substrate is sucked to the base, and controlling the drive of the hand on the basis of the detection outputs. CONSTITUTION:When a wafer hand 2 approached to a predetermined position on a stage 3, if a vacuum pump is operated in advance to maintain a stage suction face under a predetermined pressure, the driven hand 2 approaches the face of the stage 3 so that a wafer 1 starts in contact with the suction face. Then, the wafer 1 is sucked to the stage 3 by the suction force of the stage 3. The position of the wafer 1 from the stage 3 is detected by a distance measuring sensor 4, whether the wafer 1 is sucked to the stage 3 or note is detected by a vacuum sensor 5, detection outputs are input to a microcomputer or the like to control the drive of the hand 2 according to a command of the microcomputer, thereby delivering the wafer 1.</p> |
