| 摘要 |
<p>PURPOSE:To realize a multipin and a high-density mounting operation by a method wherein a substrate part of an Fe-Ni alloy and a foil-shaped lead part are bonded via an insulating layer. CONSTITUTION:A member for IC lead use is formed of a structure where a substrate part 3 composed of 35 to 55weight% of Ni and substantially of Fe for a remaining part and a foil-shaped lead part which is composed of 35 to 55weight% of Ni and of Fe for a remaining part and whose thickness is 100mum or lower are bonded via an insulating layer 2. That is to say, an Fe-Ni alloy is used for the substrate part 3 in order to obtain a thermal matching property with reference to a semiconductor chip; the thickness of the lead part 1 is set at 100mum or lower in order to easily execute a fine working operation. The lead part 1 formed in this manner is fixed to the substrate part 3 and to the insulating layer 2; it is possible to prevent leads from being displaced and step differences from occurring; a multipin structure and a high-density mounting operation can be realized.</p> |
