发明名称 SEMICONDUCTOR PACKAGE AND COMPUTER USING SAME
摘要 PURPOSE:To keep the delay time of a signal to a minimum by wiring a signal line not to be affected by influence of permittivity of the substrate. CONSTITUTION:A current for a power source is fed from a semiconductor element 1 to conductive path 9 through wirings 7 for the power source, and to the interior of an electrically insulating substrate 2. Then, the current is transmitted to metal pins 5 for the power source at the end of the substrate 2, and fed out of a package. The self-induction component of the path depends upon the lengths and sectional areas of the wirings 7, the path 9 and pins 4 for signal lines. On the other hand, since the periphery of the path 9 is surrounded by conductors and two paths of different potentials are opposed at a near distance, its capacitive component is increased. Thus, a transmission path is so provided as not to be affected by the influences of the inductance and capacitive components as a signal current as much as possible and also so provided as to increase the capacitive component while decreasing the inductive component as a power source current. In this manner, a signal transmission delay time can be shortened.
申请公布号 JPH0294532(A) 申请公布日期 1990.04.05
申请号 JP19880244140 申请日期 1988.09.30
申请人 HITACHI LTD 发明人 TANAKA AKIRA;INOUE KOICHI;YAMADA KAZUJI;MIYAZAKI KUNIO;MIURA OSAMU;ARAKAWA HIDEO;YOKOYAMA HIROSHI;NAGANUMA YOSHIO;MORIHARA ATSUSHI;OUCHI KAZUNORI
分类号 G06F1/18;H01L21/60;H01L23/057;H01L23/467;H01L23/498;H01L23/50;H01L25/065 主分类号 G06F1/18
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