| 摘要 |
PURPOSE:To prevent development of a bridge by jetting hot blast through a nozzle, by spraying it to an aimed area, by dissolving solder for soldering, by moving this heated jet flow, and by moving excessive solder successively by use of blowing action of jet flow. CONSTITUTION:Cream solder is applied to a packaging substrate 8, and QFP (Quad Flat package) 7 is placed thereon. Hot blast is sprayed in spot through a nozzle 6 to a solder section on a pad to dissolve the solder. Hot blast to the nozzle 6 is developed by a hot blast developing device 5 and supplied through a hot blast transmission tube 4 and a nozzle holding head 1. In the meantime, movement along pad arrangement is made by a biaxial rectangular robbot 2. A lead and a pad are soldered by heated jet flow from the nozzle 6 and excessive solder which is blown successively is moved to a solder gathering pad 10 at the end of a pad line. Development of a bridge can be thereby prevented. |
