| 摘要 |
PURPOSE:To prevent cracks in a sealing resin layer by a thermal load from being caused by controlling a distance between the bottom of a recessed part formed inside from the surface in the central part of the sealing resin layer and the surface of the sealing resin layer. CONSTITUTION:In order to surface-mount a semiconductor element 4 which has been fixed to a head part 2 of a lead frame 1 and has been covered with a sealing resin layer 3, this assembly is fixed temporarily by using an adhesive 6 coated in the neighborhood of a recessed part 5 and is fixed by a soldering operation. When its distance is controlled during this process, it is possible to restrain the adhesive layer 6 from swelling. In order to control a distance between the bottom of this recessed part 5 and the surface of the sealing resin layer 3, a size of an ejector pin formed so as to protrude at the inside of a cavity formed at a lower-part mold of a metal mold is adjusted according to a type of a semiconductor device to be treated, i.e., the thickness of the sealing resin layer 3. Thereby, it is possible to prevent cracks in the sealing resin layer 3 from being produced. |
