APPARATUS AND METHOD FOR ELECTRICALLY CONNECTING POLYMERIC CONDUCTIVE MATERIAL

摘要

Flexible flat ribbon cables with a polyester binder silver particle conductive ink deposited on a heat bondable substrate are bonded to each other or to rigid circuit boards by applying ultrasonic energy to the cables. The conductors are bonded to form connections and are prevented from being deformed laterally to bridge to adjacent conductors due to preferential substrate bonding between adjacent conductors. Both apparatus for and the method of preferential substrate bonding is disclosed.