发明名称 Resin composition.
摘要 <p>A resin composition having inorganic filler particles with an average particle size of from 0.05 to 150 mu m incorporated in an amount of from 20 to 85% by volume based on the entire resin composition, wherein: (a) said particles comprise at least two groups of particles differing in the average particle size, (b) particles constituting a group of particles with the smallest average particle size, are spherical particles with an average particle size smaller than 5 mu m, (c) a group or groups of particles with an average particle size larger than the particles of (b), are constituted by spherical particles, pulverized particles or a mixture thereof, (d) as between two groups of particles with their average particle sizes being close to each other, the ratio of the minimum particle size within a range defined by the standard deviation of the particle size distribution of the group of particles with a large average particle size, to the maximum particle size within a range defined by the standard deviation of the particle size distribution of the group of particles with a small average particle size, is at least 2, and (e) the proportion of the volume of the group of particles with a large average particle size, to the total volume of the two groups of particles with their average particle sizes being close to each other, is from 20 to 95% by volume. a</p>
申请公布号 EP0361109(A1) 申请公布日期 1990.04.04
申请号 EP19890115836 申请日期 1989.08.28
申请人 MITSUBISHI KASEI CORPORATION 发明人 HATTORI, EIJI;OGURI, YASUO
分类号 C08J3/20;C08K3/00;C08K7/18;C08K9/04;C08L101/00;C09C3/00;H01L23/29;H01L23/31 主分类号 C08J3/20
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