Improvements in or relating to resin compositions curable with ultraviolet light.

摘要

A UV curable adhesive has been developed with good bond strength, good lap shear strength, rapid cure times, good thermal stability, and good insulating properties. The adhesive may be applied by silk screen printing and cured by UV in about 2 seconds. The adhesive may be used in automated surface mount technology for electronic circuit fabrication. The adhesive is a mixture of from 60 to 80% by weight, based on total composition weight, of a first resin which comprises an acrylate-epoxy oligomer having a molecular weight of from 2000 to 5000; from 4 to 10% of a second resin which comprises an acrylate-urethane oligomer; from 5 up to 20% of a third resin which comprises a cresol formaldehyde oligomer, liquid acrylate diluent for said resins; from 5 to 15% of a polyfunctional acrylate monomer; and from 1 to 5% of a UV photoinitiator. The compositions are applied to substrates such as printed wiring boards and cured with ultraviolet light to form an adhesion between electronic components and the substrate.