Process for producing copper or silver/polyimide composite article.
摘要
<p>The present invention provides a process for producing a metal/polyimide composite article such as high-density wiring boards. This metal (2)/polyimide (3) composite article is produced by a method which comprises coating a polyamic acid alkyl ester represented by the following formula on a metallic film (2) and curing it: <CHEM> wherein R1 and R2 which may be identical or different each represents an organic group of 1 or more carbon atoms.</p>
