发明名称 LASER SOLDERING DEVICE
摘要 PURPOSE:To prevent a damage and a breakdown of a substrate and parts caused by the influence of preheating by a means for varying strong and weak distributions of power density of a laser light, and executing preheating to an object to be worked in a distribution area in which power density is weak. CONSTITUTION:A laser beam emitting part 1 is fixed to a robot hand 3 by an angle lock 2, and in a power density distribution of a laser beam 100 which is emitted, a weak part (a) and a strong part (b) of power density are generated. Subsequently, a robot arm 4 for holding a robot hand 3 is moved in the direction as indicated with an arrow A, and in the weak part (b) of power density, preheating of a lead 51 of a flat pack IC 5 of an object to be worked and paste solder 7 is executed, and in the strong part (a) of power density, the lead 51 of the flat pack IC 5 is soldered onto a substrate 6. In such a way, the automatization of a laser soldering work can be realized easily without damaging the substrate and parts.
申请公布号 JPH0292452(A) 申请公布日期 1990.04.03
申请号 JP19880242969 申请日期 1988.09.28
申请人 NEC CORP;NIPPON DENKI LASER KIKI ENG KK 发明人 OKINO KEIJI;ISHIKAWA KAZUMI;ODAJIMA TAKAHIRO
分类号 B23K26/00;B23K1/005;B23K26/20;H01S3/00;H05K3/34 主分类号 B23K26/00
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