| 摘要 |
PURPOSE:To relax stress generated in the bonded area and to prevent occur rence of cracking of sintered material in brazing a metallic lead frame to a sintered AlN by previously bonding a copper foil to the side of a face of the metallic lead frame to be brazed. CONSTITUTION:Molybdenum-manganese plate is attached to the surface of a sintered aluminum nitride 1 by screen printing, calcined and then a metallizing layer 2 is formed by application of nickel plating. On the other hand, a copper foil 4 is previously bonded to the side of a face of a metallic lead frame 3 (e.g., lead frame made of Kovar) to be brazed to the sintered aluminum nitride 1. Then the sintered aluminum nitride 1 is brazed to the metallic lead frame 3 by using a brazing agent 5 (e.g., silver braze). Consequently, the sintered AlN can be brazed to the metallic lead frame and a semiconductor package using AlN having excellent thermal conductivity can be done. |
