| 摘要 |
<p>PURPOSE:To attempt to prevent occurrence of cracks and breaks on the surface and the rear by actuating stress caused by a blade of a cutter to the inside from the surface and the rear. CONSTITUTION:A cutter 3a is controlled at a height so as to cut a wafer 1 from its surface to its middle part and the rotating direction is in a down cut mode which is in the cutting direction from the water surface to its inside. A cutter 3b is controlled at a height so as to cut a wafer 1 from its middle part to its rear and the rotating direction is an upper cut mode which is in the cutting direction from the wafer rear to its inside. When the wafer 1 is moved in the direction of cutters 3a and 3b, the wafer is cut from its surface to middle part by means of the cutter 3a and then the remaining uncut part of the wafer 1 is cut from its rear to its inside by means of the cutter 3b.</p> |
