| 摘要 |
Thin-film photodiodes arranged in lines on a substrate are connected to read-out chips arranged on the same substrate. They are connected thereto via thin-film interconnects which differ in length and which run parallel to one another. For compensating the interconnect capacitances given neighboring interconnects which differ in length, their widths are dimensioned smaller or larger in one or more interconnect sub-sections. Thus, the sum of the coupling capacitances of all sub-sections of two neighboring interconnects always have the same value, independently of the overall length. The invention eliminates the inhomogeneities in the sensor signal caused by the different lengths of the read-out lines. The invention is employed for opto-electronic reading equipment, particularly in office automation.
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