发明名称 Process for preparing superconductive wiring board
摘要 The present invention relates to an element comprising a superconductive material or a wiring formation technique. In a thin film wiring board in which a superconductive material is used as a conductor, annealing should be conducted at a high temperature in an oxygen atmosphere after formation of a film in order to convert the conductor portion into a superconductive material, which makes it necessary to use an inorganic oxide as the insulating film. This brought about a problem that the etching of the second and subsequent insulation layers causes a damage to the wiring and insulation layer provided thereunder. In the present invention, an over-etching preventing layer is provided on a wiring layer provided under the second and subsequent insulation layers in order to solve the problem in question. The present invention brings about an effect of realizing the formation of a multi-layered wiring layer by making use of a superconductive material.
申请公布号 US4913769(A) 申请公布日期 1990.04.03
申请号 US19880228297 申请日期 1988.08.04
申请人 HITACHI, LTD. 发明人 KANDA, NAOYA;SOWA, TAKAYOSHI;YAMAZAKI, TETSUYA;OKUDAIRA, HIROAKI
分类号 H01L39/24 主分类号 H01L39/24
代理机构 代理人
主权项
地址
您可能感兴趣的专利