发明名称 |
Process for preparing superconductive wiring board |
摘要 |
The present invention relates to an element comprising a superconductive material or a wiring formation technique. In a thin film wiring board in which a superconductive material is used as a conductor, annealing should be conducted at a high temperature in an oxygen atmosphere after formation of a film in order to convert the conductor portion into a superconductive material, which makes it necessary to use an inorganic oxide as the insulating film. This brought about a problem that the etching of the second and subsequent insulation layers causes a damage to the wiring and insulation layer provided thereunder. In the present invention, an over-etching preventing layer is provided on a wiring layer provided under the second and subsequent insulation layers in order to solve the problem in question. The present invention brings about an effect of realizing the formation of a multi-layered wiring layer by making use of a superconductive material.
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申请公布号 |
US4913769(A) |
申请公布日期 |
1990.04.03 |
申请号 |
US19880228297 |
申请日期 |
1988.08.04 |
申请人 |
HITACHI, LTD. |
发明人 |
KANDA, NAOYA;SOWA, TAKAYOSHI;YAMAZAKI, TETSUYA;OKUDAIRA, HIROAKI |
分类号 |
H01L39/24 |
主分类号 |
H01L39/24 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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