发明名称 COMPOSITE MOLDING OF METAL AND POLYIMIDE
摘要 <p>PURPOSE:To constitute the title composite molding so that it is not deteriorated even not under a specific atomosphere such as a reducing atmosphere by preventing heat deterioration of a polyimide film, by a method wherein an acid functional group such as a carboxyl group or a sulfone group in a polyimide precursor is masked. CONSTITUTION:The title composite molding is manufacture by including a process where a polyimide precursor is imidated by coming into contact with a metal. The polyimide precursor is obtained by masking an acid functional group such as a carboxyl group or a sulfone group of the precursor. In other words, when the metal is dissolved under the existence of carboxylic acid of polyamic acid and then the same is exposed under a high temperature, an imide annulus is pyrolytically decomposed by the metal and at the same time a metal oxide in a particulate state is precipitated away. Then a similar phenomenon to this is observed even on the polyimide precursor having a sulfone acid group and the existence of the acid functional group permits its dissolution is the metal.</p>
申请公布号 JPH0292535(A) 申请公布日期 1990.04.03
申请号 JP19880243986 申请日期 1988.09.30
申请人 HITACHI LTD 发明人 NUMATA SHUNICHI;MIWA TAKAO;IKEDA TAKAE;FUJISAKI KOJI;SHIMANOKI HISAE;MIYAZAKI KUNIO;MIURA OSAMU;WATANABE RYUJI;MIYAMOTO TOSHIO;OGOSHI YUKIO
分类号 B32B15/088;B32B15/08;C08G73/10;H01B1/22;H01B3/30;H01L21/48;H01L23/14;H05K1/03 主分类号 B32B15/088
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