| 摘要 |
<p>PURPOSE:To prevent the occurrence of wrinkles caused by a thermal expansion and contraction of a surrounding part by a method wherein a window which is provided on an oversheet for an externally connecting terminal is made slightly larger than the dimension of the terminal, and the oversheet is overlapped so that the externally connecting terminal is positioned on the center of the window, thereafter being bonded under heat and pressure. CONSTITUTION:A top oversheet 14 and a back oversheet 15 are disposed overlappedly on the top and back sides of a substrate 11 and a center core 13, respectively. The top oversheet 14 is provided with windows 14a for exposing externally connecting terminals 12 on the surface of the substrate 11 in its lapped state. The window 14a is formed to have a slightly larger dimension than the corresponding externally connecting terminal 12. The top oversheet 14 is overlapped while the externally connecting terminal 12 is positionally adjusted on nearly the center of the window 14a. Thereafter, the laminated body of the substrate 11/the center core 13, the top oversheet 14, and the back oversheet 15 which are lappedly disposed as mentioned above is bonded under heat and pressure by a platen press, whereby an IC card with externally connecting terminal part is obtained.</p> |
